Low Viscosity Self Leveling Epoxy Potting Glue for Electronics

Product Description

Product Description

HY484 Epoxy Potting Compound : Comprehensive Encapsulation & Protection for Electronic Components

HY484 is a premium series of two-component, room-temperature curing epoxy resin systems designed for the potting, sealing, and insulation of sensitive electronic assemblies. Known for its exceptional self-leveling properties and high hardness, HY484 protective barrier against moisture, vibration, and electrical breakdown. Whether you need optical clarity for LEDs or high-power thermal management, the HY484 series offers a specialized grade to ensure the longevity of your PCBAs and modules.

Product Features 

1,Superior Electrical Insulation: Engineered with high dielectric strength to prevent electrical leakage and short circuits in high-density components.

2,Exceptional Hardness & Mechanical Protection: Cures to a high-strength solid (Shore D ≥ 80) that resists physical impact, vibration, and environmental stress.

3,Excellent Self-Leveling: Low-viscosity formula ensures deep penetration into complex gaps and bubble-free encapsulation.

4,Environmental Resilience: Solvent-free and low-VOC; provides long-term resistance to aging, moisture, and UV degradation.

5,Non-Corrosive: Completely safe for delicate electronic circuits, copper wiring, and semiconductor materials.

Performance indicators			HY484T	HY484P	HY484L	HY484D
Before curing		Appearance and color(A /B)	Transparent liquid	black/brown	black/brown	black/brown
		Viscosity(Pa·s, A/B)	4 / 0.7	18 / 0.1	12 / 0.1	18 / 0.1
		Density(g/cm3, A/B)	1.1 / 1.0	1.6 / 1.1	1.5 / 1.1	1.8 / 1.1
Weight ratio (A:B)			2:1	5:1	5:1	5:1
Operational time (min)			30	60	60	60
Full curing time (h)			48	48	48	48
After curing	hardness (S.D)		≥80	≥80	≥80	≥80
	Linear shrinkage rate (%)		0.8	0.5	0.5	0.5
	Thermal conductivity (W/m•k)		0.3	0.3	0.3	0.7
	Flame retardant grade (UL94)		/	/	/	V0
	Dielectric strength (kv/mm)		≥25
	Volume resistance (Ω•cm)		1.2×1014
	Operating temperature range (℃)		-40~90

Application

Primary Applications 

1,Power Electronics: Encapsulation of power supplies, converters, and transformers.

2,Automotive Electronics: Protection of sensors, igniters, and control units against engine heat and moisture.

3,Lighting Industry: Potting of LED drivers and outdoor lighting modules (HY484T).

4,Industrial Automation: Sealing of PCBAs in controllers and communication equipment.

Company Profile

Zhengzhou Huayu Technology Co., Ltd.: Professional Adhesive Solutions Since 1997

Founded in 1997 as Zhengzhou Huayu Adhesive Factory, Jiagu® & Relanda® have evolved into a premier high-tech manufacturer specializing in the R&D, production, and global distribution of advanced adhesives and sealants.

Our state-of-the-art manufacturing base in the Baofeng High-Tech Zone spans 37,000 square meters with a total building area of 45,000 square meters. Equipped with modernized, fully automated production lines, we maintain a robust annual production capacity of 50,000 metric tons, ensuring a stable and reliable supply chain for our global partners.

In 2015, our commitment to industrial excellence led to our successful listing on the Shanghai Equity Exchange. We offer a comprehensive portfolio of over 300 products across 10 chemical categories, including Silicones, MS Polymers, Polyurethanes, Epoxies, and Anaerobics, serving critical industries from Aerospace and Automotive to Renewable Energy and Construction.

Company Advantage

1.Certifications: We strictly adhere to international quality standards, holding ISO 9001, SGS, CE, UL, and TUV certifications to ensure seamless market entry in Europe, North America, andbeyond.

2.Innovation-Led: As a national High-Tech Enterprise, we operate a dedicated Adhesion Technology Center and hold multiple invention patents, allowing us to provide cutting-edge solutions for complex bonding challenges.

3.We don't just sell glue; we provide solutions. Our team offers full technical support, including TDS/SDs documentation, customized formulations, and application guidance to ensure your project's success.

4.50,000 Tons Annual Output: We have the scale to handle high-volume OEM/ODM orders with consistent quality.

Broad Material Spectrum: From MS Polymers to Epoxies, we eliminate the need for multiple vendors, saving you time and logistics costs.

Our Certificate & Exhibition

Packaging & Shipping

FAQ

Q1: Are your products certified for international markets?
A: Yes. We hold ISO 9001, SGS, CE, UL, and TUV certifications. Our products comply with international environmental and safety standards (such as RoHS and REACH), making them ready for immediate use in Europe, North America, and beyond.

Q2: Can you provide customized formulations (OEM/ODM)?
A: Absolutely. With our own Adhesion Technology Center and multiple invention patents, we can tailor the viscosity, curing time, and strength of our adhesives to meet your specific industrial requirements.

Q3: What is your Minimum Order Quantity (MOQ)?
A: MOQs vary depending on the product type (e.g., cartridges vs. drums). For standard items, we are flexible to support trial orders. Please contact our sales team for a specific quote.

Q4: Do you provide free samples for testing?
A: Yes, we provide samples for quality evaluation. We believe in our products' performance, and we want to ensure they are the perfect fit for your application before you commit to a bulk order.

Q5: What's the delivery time? 
A: It's about 5~10days according to order quantity after payment. For example, the producing time is 5 days for 1000 tons sealant.